Science & Technology
SBIR Phase I: Efficient Transfer Technology for Ultra-Thin Dies (UTD) in Advanced Semiconductor Chip Packaging
National Science Foundation
Opportunity #: 2505353
Award Ceiling
$305K
Award Floor
$305K
Close Date
Mar 31, 2026
16 days leftTotal Funding
$305K
Expected Awards
1
Posted Date
Mar 31, 2025
Cost Sharing Required
No
Grants.gov ID
sbir-2505353
Description
SBIR Phase Phase I award: "SBIR Phase I: Efficient Transfer Technology for Ultra-Thin Dies (UTD) in Advanced Semiconductor Chip Packaging" awarded to LuxNour Technologies Inc in Hillsboro, Oregon. Funded by National Science Foundation. Award amount: $304,507. The SBIR/STTR programs fund innovative research and development by small businesses, with Phase I for feasibility studies and Phase II for full R&D.
Eligible Applicants
Small businesses
Apply on Grants.gov
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View on Grants.govDisclaimer: This information is sourced from Grants.gov and may not reflect the most current details. Always verify eligibility requirements, deadlines, and application procedures on the official program website before applying.